TSMC's Revolutionary Packaging Technology: The Future of AI Chips, the End of Wafers?

Introduction

In the wave of artificial intelligence, the surge in computing demands is driving continuous innovation in the semiconductor industry. TSMC, as the world's leading chip manufacturer, is exploring a new chip packaging technology that could completely change our understanding of wafers.

TSMC's Exploration of New Packaging Technology

According to reports from Nikkei Asia, TSMC is researching a revolutionary chip packaging method to meet the computing demands brought by AI. The core of this technology is to use a rectangular substrate measuring 510 millimeters by 515 millimeters, replacing the traditional round wafers. This design can place more chips on each substrate, significantly improving production efficiency.

Advantages of Rectangular Substrates

Compared with traditional round wafers, the effective area of rectangular substrates is more than three times larger, while reducing the ineffective edge areas. This change not only improves production efficiency but also means that more computing power can be integrated within the same area, providing stronger computing support for AI data centers.

Technical Challenges and Industry Transformation

Although this technology is still in its early stages, it marks an important shift for TSMC in technology. Previously, TSMC believed that using rectangular substrates was too challenging. However, with the increase in chip size and the demand for more memory integration, 12-inch wafers may not meet the packaging needs of cutting-edge chips within a few years.

Joint Exploration by Industry Giants

In addition to TSMC, Intel and Samsung are also working with suppliers to explore panel-level packaging technology. At the same time, chip packaging and testing service providers, such as Powertech Technology, as well as display manufacturers, such as BOE Technology Group and Innolux, are also investing resources in the development of panel-level chip packaging technology, accelerating the innovation and diversification process of the semiconductor industry.

Analyst Perspective

Mark Li, a semiconductor analyst at Bernstein Research, believes that this technological transformation may require five to ten years to achieve a comprehensive facility upgrade, including the transformation of robotic arms and automated material handling systems.

Conclusion

TSMC's exploration of new packaging technology is not only a bold innovation of the existing production method but also a profound impact on the future development of the semiconductor industry. With the continuous advancement of technology, we have reason to believe that the future of AI chips will be brighter, and traditional wafers may gradually exit the historical stage.

Risk Warning

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